Thermal Stress and Strain in Microelectronics Packaging, Fachbücher von John Lau

John Lau | Thermal Stress And Strain In Microelectronics Packaging |

Microelectronics Packaging Handbook, Fachbücher

RF and Microwave Microelectronics Packaging, Fachbücher

Usefulness and Precision of LCA in Microelectronics Packaging, Fachbücher

Thermal Mismatch Stresses In Electronic Packaging 1661

Rf And Microwave Microelectronics Packaging 1670

Theory of Elasticity and Thermal Stresses, Fachbücher

John Lau 3d Ic Integration And Packaging (gebundene Ausgabe) (us

Static and dynamic stress-strain state of parallel tubes in deformable, Fachbücher

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Thermal Stresses Problems, Fachbücher

Thermal Mismatch Stresses, Fachbücher

Ken Kuang (u. A.) | Rf And Microwave Microelectronics Packaging |

John H. Lau Semiconductor Advanced Packaging (gebundene Ausgabe)

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