Thermal Stress and Strain in Microelectronics Packaging, Fachbücher von John Lau

John Lau | Thermal Stress And Strain In Microelectronics Packaging |

RF and Microwave Microelectronics Packaging, Fachbücher

Microelectronics Packaging Handbook, Fachbücher

Usefulness and Precision of LCA in Microelectronics Packaging, Fachbücher

Fan-Out Wafer-Level Packaging, Fachbücher von John H. Lau

RF and Microwave Microelectronics Packaging II, Fachbücher von Rick Sturdivant, Ken Kuang

Thermal Mismatch Stresses In Electronic Packaging 1661

John Lau 3d Ic Integration And Packaging (gebundene Ausgabe) (us

Rf And Microwave Microelectronics Packaging Ii 3559

Modeling of Thermal Oxidation and Stress Effects, Fachbücher

Rf And Microwave Microelectronics Packaging Ken Kuang (u. A.)

John H. Lau Semiconductor Advanced Packaging (gebundene Ausgabe)

Evaluation of Stress, Strain and Deflection of Flexible Pavements, Fachbücher von Shiferaw Garoma

John H. Lau | Semiconductor Advanced Packaging | Buch | Englisch

Advanced Materials for Thermal Management of Electronic Packaging, Fachbücher