Thermal Stress and Strain in Microelectronics Packaging, Fachbücher von John Lau

John Lau | Thermal Stress And Strain In Microelectronics Packaging |

Microelectronics Packaging Handbook, Fachbücher

Usefulness and Precision of LCA in Microelectronics Packaging, Fachbücher

Thermal Mismatch Stresses In Electronic Packaging 1661

Rf And Microwave Microelectronics Packaging 2832

John Lau 3d Ic Integration And Packaging (gebundene Ausgabe) (us

Theory of Elasticity and Thermal Stresses, Fachbücher

RF and Microwave Microelectronics Packaging, Fachbücher

Stress Analysis of Bonded Assemblies: Applications in Microelectronics, Fachbücher

Modeling of Thermal Oxidation and Stress Effects, Fachbücher

Static and dynamic stress-strain state of parallel tubes in deformable, Fachbücher

Thermal Mismatch Stresses, Fachbücher

Thermal Stresses Problems, Fachbücher

John H. Lau Semiconductor Advanced Packaging (gebundene Ausgabe)

Laser Pulse Heating of Surfaces and Thermal Stress Analysis, Fachbücher