Stress Analysis Of Bonded Assemblies: Applications In Microelectronics

Shilak Shakya | Stress Analysis Of Bonded Assemblies: Applications

Thermal analysis of power electronics and electrical assemblies, Fachbücher von Adrian Plesca

Application of the Water Footprint: Water Stress Analysis and Allocation, Fachbücher von Meng Xu, Chunhui Li

Thermal Stress and Strain in Microelectronics Packaging, Fachbücher von John Lau

Analysis and Design of Structural Bonded Joints, Fachbücher von Grant P. Steven, Liyong Tong

Computational analysis of heat stress in Plants, Fachbücher

Computational Analysis of Drought Stress in Plants, Fachbücher

Application of Data Envelopment Analysis, Fachbücher

Stress concentration in beams bonded with FRP composites, Fachbücher von Khalil Belakhdar

Modelling conditions effect on the cohesive analysis of bonded joints, Fachbücher von Raul Campilho, Ricardo Rocha

Stress Analysis of the Scapula, Fachbücher von Sanjay Gupta

Analysis of cold stress using Affymetrix microarrays, Fachbücher

Geometric Applications of Principal Component Analysis, Fachbücher

Modeling of extreme events and stress testing analysis, Fachbücher

Stress Analysis of FGM Cylinders, Fachbücher von EL-Sayed Habib